Current-controlled CMOS circuits with inductive broadbanding

ABSTRACT

Various circuit techniques for implementing ultra high speed circuits use current-controlled CMOS (C 3 MOS) logic with inductive broadbanding fabricated in conventional CMOS process technology. Optimum balance between power consumption and speed for each circuit application is achieve by combining high speed C 3 MOS logic with inductive broadbanding /C 3 MOS logic with low power conventional CMOS logic. The combined C 3 MOS logic with inductive broadbanding /C 3 MOS /CMOS logic allows greater integration of circuits such as high speed transceivers used in fiber optic communication systems.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of and claims the benefit of U.S.provisional patent application No. 60/184,703, filed Feb. 24, 2000, thedisclosure of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention relates in general to high speed logic circuitry,and in particular to current-controlled CMOS (or C³MOS™) logic circuitswith inductive broadbanding.

For a number of reasons CMOS is the logic family of choice in today'sVLSI devices. Due to the complementary nature of its operation, CMOSlogic consumes zero static power. CMOS also readily scales withtechnology. These two features are highly desirable given the drasticgrowth in demand for low power and portable electronic devices. Further,with the computer aided design (CAD) industry's focus on developingautomated design tools for CMOS based technologies, the cost and thedevelopment time of CMOS VLSI devices has reduced significantly.

The one drawback of the CMOS logic family, however, remains its limitedspeed. That is, conventional CMOS logic has not achieved the highestattainable switching speeds made possible by modern sub-micron CMOStechnologies. As a result of the speed limitations of conventional CMOSlogic, integrated circuit applications in the Giga Hertz frequency rangehave had to look to alternative technologies such as ultra high speedbipolar circuits and Gallium Arsenide (GaAs). These alternativetechnologies, however, have drawbacks of their own that have made themmore of a specialized field with limited applications as compared tosilicon MOSFET that has had widespread use and support by the industry.In particular, compound semiconductors such as GaAs are more susceptibleto defects that degrade device performance, and suffer from increasedgate leakage current and reduced noise margins. Furthermore, attempts toreliably fabricate a high quality oxide layer using GaAs have not thusfar met with success. This has made it difficult to fabricate GaAs FETs,limiting the GaAs technology to junction field-effect transistors(JFETs) or Schottky barrier metal semiconductor field-effect transistors(MESFETs). A major drawback of the bipolar technology, among others, isits higher current dissipation even for circuits that operate at lowerfrequencies.

SUMMARY OF THE INVENTION

A significant improvement in speed of operation of CMOS circuitry hasbeen achieved by a family of CMOS logic that is based oncurrent-controlled mechanism. Current-controlled CMOS (or C³MOS) logicis described in greater detail in commonly-assigned patent applicationSer. No. 09/484,856, entitled “Current-Controlled CMOS Logic Family,” byHairapetian, which is hereby incorporated in its entirety for allpurposes. The basic building block of the C³MOS logic family uses a pairof conventional MOSFETs that steer current between a pair of loaddevices in response to a difference between a pair of input signals.Thus, unlike conventional CMOS logic, C³MOS logic dissipates staticcurrent, but operates at much higher speeds.

According to one aspect of the invention, to further enhance speed ofoperation of circuits implemented in CMOS technology, the presentinvention introduces inductive elements in the C³MOS circuits. In aspecific embodiment, a spiral inductor is inserted in series with theload devices of selected C³MOS structures that process high-bandwidthdata signals. The resulting series combination of inductor and resistiveelement (e.g., polysilicon resistors) that is in parallel with anexisting capacitive load provides a high impedance at a higher bandwidththan would be possible without the presence of the inductor. Optimizedvalues for the inductors ensure appropriate placement of the circuit'snatural frequencies in the complex plane to achieve fast rise and falltimes with appropriate overshoot and undershoot. The present inventioncombines the use of this type of shunt peaking with C³MOS circuits thatprocess broadband bi-level (i.e., digital as opposed to analog)differential signals. The combination of these characteristics allowsfor improvement of the output signal's inter-symbol interference withoutany increase in power dissipation.

According to another aspect of the invention, a multiplexer circuitincludes C³MOS with inductive broadbanding to facilitate operation atultra-high frequencies.

According to another aspect of the invention, a flip-flop is implementedutilizing C³MOS with inductive broadbanding to operate at ultrahighfrequencies.

According to another aspect of the invention, a complementarymetal-oxide-semiconductor (CMOS) logic circuitry combines on the samesilicon substrate, current-controlled MOSFET circuitry of the typedescribed above for high speed signal processing, with conventional CMOSlogic that does not dissipate static current. Examples of such combinedcircuitry include serializer/deserializer circuitry used in high speedserial links, high speed phase-locked loop dividers, and the like.

Other features and advantages of the invention will be apparent in viewof the following detailed description and appended drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of differential pair including inductivebroadbanding implemented with CMOS technology;

FIG. 2(a) is a schematic diagram of the circuit of FIG. 1 without theshunt inductor;

FIG. 2(b) is a simplified diagram depicting the transient behavior ofthe circuit of FIG. 2(a);

FIG. 2(c) is a graph depicting the difference between ideal and C³MOSstep responses;

FIG. 3 is a graph depicting the step response of the circuit of FIG. 1for four values of series inductance;

FIG. 4(a) is a graph depicting inter-symbol interference (ISI) vs. inputpulse width for five values of series inductance;

FIG. 4(b) is a graph depicting the output signal of the circuit of FIG.1 with and without inductors;

FIG. 5 is shows a block diagram for a circuit that combines C³MOS withinductive broadbanding, C³MOS, and conventional CMOS logic on a singlesilicon substrate to achieve optimum tradeoff between speed and powerconsumption;

FIG. 6(a) is a schematic diagram of a serializer circuit utilizingfeatures of the invention;

FIG. 6(b) is a more detailed depiction of the 2:1 MUX depicted in FIG.6(a);

FIG. 7 is a circuit diagram of a MUX utilizing features of the presentinvention;

FIG. 8 is a circuit diagram of a flip-flop utilizing features of theinvention; and

FIG. 9 is a simplified block diagram of a transceiver system thatutilizes the C³MOS with inductive broadbanding /C³MOS /CMOS combinedlogic according to the present invention to facilitate interconnectinghigh speed fiber optic communication channels.

DESCRIPTION OF THE SPECIFIC EMBODIMENTS

The present invention provides ultra high-speed logic circuitryimplemented in silicon complementary metal-oxide-semiconductor (CMOS)process technology. A distinction is made herein between the terminology“CMOS process technology” and “CMOS logic.” CMOS process technology asused herein refers generally to a variety of well established CMOSfabrication processes that form a field-effect transistor over a siliconsubstrate with a gate terminal typically made of polysilicon materialdisposed on top of an insulating material such as silicon dioxide. CMOSlogic, on the other hand, refers to the use of complementary CMOStransistors (n-channel and p-channel) to form various logic gates andmore complex logic circuitry, wherein zero static current is dissipated.The present invention uses current-controlled mechanisms with inductivebroadbanding to develop a family of very fast current-controlled CMOS(or C³MOS™) with inductive broadbanding logic that can be fabricatedusing a variety of conventional CMOS process technologies, but thatunlike conventional CMOS logic does dissipate static current. C³MOS withinductive broadbanding logic or current-controlledmetal-oxide-semiconductor field-effect transistor (MOSFET) logic areused herein interchangeably.

In a preferred embodiment, the basic building block of this logic familyis an NMOS differential pair with series connected inductive/resistive(LR) loads.

FIG. 1 illustrates the basic C³MOS differential pair 200 with shuntinductors L, and load capacitors C_(L). A pair of n-channel MOSFETs 202and 204 receive differential logic signals V_(in)+ and V_(in)− at theirgate terminals, respectively. Resistive loads 206 and 207 in series withshunt inductors 208 and 209 connect the drain terminals of MOSFETs 202and 204, respectively, to the power supply VDD. Drain terminals ofMOSFETs 202 and 204 form the outputs V_(out)− and V_(out)+ of thedifferential pair, respectively. In a preferred embodiment, the shuntinductors 208 and 209 are spiral inductors coupled to the substrateutilizing standard techniques. Resistive loads 206 and 207 may be madeup of either p-channel MOSFETs operating in their linear region, orresistors made up of, for example, polysilicon material. In a preferredembodiment, polysilicon resistors are used to implement resistive loads206 and 207, which maximizes the speed of differential pair 200. Thesource terminals of n-channel MOSFETs 202 and 204 connect together atnode 210. A current-source n-channel MOSFET 212 connects node 210 toground (or negative power supply). A bias voltage VB drives the gateterminal of current-source MOSFET 212 and sets up the amount of currentI that flows through differential pair 200. In response to thedifferential signal at V_(in)+ and V_(in)−, one of the two inputn-channel MOSFETs 202 and 204 switches on while the other switches off.All of current I, thus flows in one leg of the differential pair pullingthe drain terminal (V_(out)+ or V_(out)−) of the on transistor down tologic low, while the drain of the other (off) transistor is pulled uptoward logic high. Shunt peaking, according to the present invention,can be selectively applied to those parts of an integrated circuit thatrequire the bandwidth enhancement.

In FIG. 1, the input levels V_(in)+ and V_(in)− vary symmetrically inopposite directions when a digital signal is received. For example ifV_(in)+ swung positive then V_(in)− would swing negative. The voltagelevels at V_(out)− and V_(out)+ swing in the same direction as therespective input signal levels. For reasons described more fully below,for broadband signals including frequencies in the range of over 5GigaHz the transient response of the circuit must be fast.

FIGS. 2(a) and (b) respectively depict the circuit of FIG. 1 with theinductors removed, resulting in a C³MOS buffer, and a simple equivalentcircuit illustrating the transient behavior of the circuit. In this casethe output transient waveform is characterized by an exponentialwaveform with a time constant RC. This waveform is depicted in FIG. 2(c)with a label “C³MOS” and has an initial slope of I/C_(L). The differencebetween the ideal and exponential step response is also depicted in FIG.2(c).

In the circuit of FIG. 2(a) the transient response of the output signalwould be controlled by the RC time constant. It is clear from FIG. 2(c)that the presence of the load resistor significantly slows down thetransient step response. Thus, when an input signal is received with avery fast rise time the current increases rapidly to charge or dischargethe load capacitor. However, the transient response of the output signalis controlled by the RC time constant and can have a longer rise timethan the input pulse.

Now, considering the circuit as disclosed in FIG. 1, including theinductors, as is well-known in the art an inductor resists a change incurrent. Thus, when the drain current changes in response to an inputsignal the inductor chokes off current flow through the resistor so thatthe capacitor discharges rapidly to generate an output signal with asmall rise time.

The larger the value of series inductance, the longer the full value ofthe current is available to charge/discharge the load capacitances. FIG.3 shows the step response for 4 different values of series inductance.

From FIG. 3 it is clear that higher values of inductance decrease therise time. However, if the inductance value becomes too large, anexcessive overshoot will occur. To determine the optimum value ofinductance, the pulse response for a set of input pulses is observedwith varying pulse widths. The graphs in FIG. 4(a) show the relativeerror between output and input pulse widths (referred to as intersymbolinterference or ISI) for 4 values of inductance.

From the FIG. 4(a) graphs it is apparent that given the values of R andC_(L), the optimum inductor value is given by:L _(S(opt))=(0.35)*C _(L) R ²

FIG. 4(b) depicts the output signals for the circuit of FIG. 1 with andwithout the inductors. The magnitude of the time intervals between zerocrossing points of the output signal provide important information forinterpreting the input signal. As depicted in FIG. 4(b), the slope ofthe waveform zero-crossings is sharper when the inductors are includedin the circuit thereby more precisely defining the time intervalsbetween zero-crossing points and reducing inter-symbol interference.

In one embodiment of the present invention a transceiver circuit along afiber optic channel deserializes an input data stream with a bit rateof, for example, 10 Gb/s. After processing the lower frequencydeserialized data, the data is serialized before transmission back ontothe fiber channel. According to the present invention, those parts ofthis circuitry that process the highest speed data (e.g., input to thedeserializer and output of the serializer) are implemented by C³MOScircuitry with inductive broadbanding.

FIG. 5 shows a simplified block diagram illustrating this exemplaryembodiment of the invention. A C³MOS with inductive broadbanding inputcircuit 40 receives a high frequency input signal IN and outputs a firstdivided down version of the signal IN/n. A C³MOS MUX 42 then receivesthis first divided down version and divides the received signal down byanother factor of m to output a second divided down version of thesignal IN/(n×m). The lower frequency signal IN/(n×m) is then processesby core circuitry 44 that is implemented in conventional CMOS logic. Thelow frequency signal from the core logic is then increased in frequencyby the reverse process to form an output signal at the original highinput frequency.

FIG. 6(a) shows an exemplary 16:1 serializer according to the presentinvention. The serializer includes a 16:8 multiplexer 50 that convertsthe data rate to 1.25 Gb/s, followed by an 8:4 multiplexer 54 thatconverts the data rate to 2.5 Gb/s. The 2.5 Gb/s data is furtherconverted to a 5 Gb/s data by a 4:2 multiplexer 56, and finally to a 10Gb/s data by a 2:1 multiplexer 58. A flip flop 60 at the output re-timesthe 10 Gb/s data to generate the final output data stream.

According to this embodiment of the invention, the circuit of FIG. 6(a)may combine conventional CMOS logic used for the lower speedmultiplexers and core processing circuitry, with C³MOS logic for themid-rate multiplexers, and C³MOS logic with inductive broadbanding forthe highest speed multiplexer (i.e., the 2:1 multiplexer 58) as well asthe output re-timing flip flop 60.

As illustrated by the various C³MOS with inductive broadbanding logicelements described below, all of the building blocks of any logiccircuitry can be constructed using the C³MOS with inductive broadbandingtechnique of the present invention. More complex logic circuits such asshift registers, counters, frequency dividers, etc., can be constructedin C³MOS with inductive broadbanding using the basic elements describedabove. As mentioned above, however, both C³MOS and C³MOS with inductivebroadbanding logic does consume static power. Additionally, thefabrication of C³MOS with inductive broadbanding logic is more expensivethan C³MOS or CMOS because of the need to add inductors to the IC.

The static current dissipation of C³MOS and/or C³MOS with inductivebroadbanding may become a limiting factor in certain large scale circuitapplications. In one embodiment, as depicted for example in FIGS. 5 and6(a), the present invention combines C³MOS with inductive broadbandingand C³MOS logic with conventional CMOS logic to achieve an optimumbalance between speed and power consumption. According to thisembodiment of the present invention, an integrated circuit utilizesC³MOS with inductive broadbanding logic for the ultra high speed (e.g.,10 Gb/s) portions of the circuitry, C³MOS for very high speed parts ofthe circuit (e.g., 2.5-5 Gb/s), and conventional CMOS logic for therelatively lower speed sections. For example, to enable an integratedcircuit to be used in ultra high speed applications, the input andoutput circuitry that interfaces with and processes the high speedsignals is implemented using C³MOS with inductive broadbanding. Thecircuit also employs C³MOS to divide down the frequency of the signalsbeing processed to a low enough frequency where conventional CMOS logiccan be used. The core of the circuit, according to this embodiment, istherefore implemented by conventional CMOS logic that consumes zerostatic current.

FIG. 6(b) shows an implementation of the 2:1 multiplexer 58 wherein theactual output multiplexing circuit 62 uses C³MOS with inductivebroadbanding an implementation of which is shown in FIG. 7.

FIG. 7 shows an exemplary C³MOS with inductive broadbandingimplementation for a 2:1 multiplexer 62. Similar to the other C³MOSlogic gates, multiplexer 62 includes a differential pair for each input.The positive (left) input transistor of each differential pair iscoupled to VDD through by a first resistor 206 connected in series witha first series inductor 208 and the negative (right) input transistor ofeach differential pair is coupled to VDD through by a second resistor207 connected in series with a second series inductor 209. Themultiplexer 62 further includes select transistors 502 and 504 insertedbetween the common source terminals of the differential pairs and thecurrent source transistor 506. By asserting one of the select inputsignals SELA or SELB, the bias current is steered to the differentialpair associated with that select transistor. Thus, signal SELA steersthe bias current to the differential pair with AP and AN inputs, andsignal SELB steers the bias current to the differential pair with BP andBN inputs.

FIG. 8 shows an exemplary implementation of a C³MOS flip flop withinductive broadbanding for use as the re-timing flip flop in theserializer of FIG. 5. A C³MOS master-slave flip-flop 800 according tothe present invention can be made by combining two latches 802 and 804.A first latch 802 receives differential input signals D and {overscore(D)} and generates differential output signals QI and {overscore (QI)}.The differential output signals QI and {overscore (QI)} are then appliedto the differential inputs of a second latch 804. The differentialoutputs Q and {overscore (Q)} of second latch 804 provide the outputs offlip-flop 800. The input transistors of each latch are coupled to VDD bya resistor and shunt inductor coupled in series.

It is to be understood that all C³MOS logic elements, numerous examplesof which are described on the above-referenced commonly-assigned patentapplication, can employ the inductive broadbanding technique accordingto the present invention.

According to one embodiment of the present invention the combined C³MOSwith inductive broadbanding /C³MOS /CMOS circuit technique is employedin a transceiver of the type illustrated in FIG. 9. The exemplarytransceiver of FIG. 9 is typically found along fiber optic channels inhigh speed telecommunication networks. The transceiver includes at itsinput a photo detect and driver circuit 1200 that receives the inputsignal from the fiber optic channel. Circuit 1200 converts fiber-opticsignal to packets of data and supplies it to a clock data recovery (CDR)circuit 1202. CDR circuit 1202 recovers the clock and data signals thatmay be in the frequency range of about 10 GHz, or higher. Establishedtelecommunication standards require the transceiver to perform variousfunctions, including data monitoring and error correction. Thesefunctions are performed at a lower frequency. Thus, the transceiver usesa demultiplexer 1204, depicted in FIGS. 5 and 6, which deserializes the10 Gb/s data stream into, for example, 16 parallel signals having a bitrate of about 622 Mb/s. An application specific integrated circuit(ASIC) 1206 then performs the monitoring and error correction functionsat the lower (622 Mb/s) bit rate. A multiplexer and clock multiplicationunit (CMU) 1208 converts the parallel signals back into a single bitstream at 10 Gb/s. This signal is then retransmitted back onto the fiberoptic channel by a laser drive 1212. The combined C³MOS with inductivebroadbanding /C³MOS /CMOS technique of the present invention allowsfabrication of demultiplexer 1204, ASIC 1206 and multiplexer and CMU1208 on a single silicon die. That is, demultiplexer 1204 andmultiplexer and CMU 1208 are implemented in C³MOS with inductivebroadbanding /C³MOS with ASIC 1206 implemented in conventional CMOS.

In conclusion, the present invention provides various circuit techniquesfor implementing ultra high speed circuits using current-controlled CMOS(C³MOS) logic and C³MOS with inductive broadbanding logic fabricated inconventional CMOS process technology. In one embodiment, the presentinvention advantageously combines high speed C³MOS with inductivebroadbanding /C³MOS with inductive broadbanding /C³MOS logic with lowpower conventional CMOS logic. According to this embodiment circuitssuch as transceivers along fiber optic channels can be fabricated on asingle chip where the ultra-high speed portions of the circuit utilizeC³MOS with inductive broadbanding /C³MOS and the relatively lower speedparts of the circuit use conventional CMOS logic.

While the above is a complete description of the preferred embodiment ofthe present invention, it is possible to use various alternatives,modifications and equivalents. For example, although spiral inductorsand poly resistors are utilized in the preferred embodiment othertechniques known to persons of skill in the art can be utilizedTherefore, the scope of the present invention should be determined notwith reference to the above description but should, instead, bedetermined with reference to the appended claims, along with their fullscope of equivalents.

1. A circuitry fabricated on a silicon substrate, the circuitrycomprising: a deserializer, implemented using current-controlledcomplementary metal-oxide semiconductor (C³MOS) logic with inductivebroadbanding, that receives an input signal having a first frequency andgenerates a first plurality of signals there from such that each signalof the first plurality of signals has a second frequency that is lowerthan the first frequency; core circuitry, implemented using conventionalcomplementary metal-oxide-semiconductor (CMOS) logic, that iscommunicatively coupled to the deserializer and that processes eachsignal of the first plurality of signals having the second frequencythereby generating a second plurality of signals such that each signalof the second plurality of signals also has the second frequency; and aserializer, implemented using C³MOS logic with inductive broadbanding,that is communicatively coupled to the core circuitry and that receiveseach signal of the second plurality of signals and that generates anoutput signal there from that has the first frequency.
 2. The circuitryof claim 1, wherein: at least one of the serializer and the deserializeris implemented using first and second n-channelmetal-oxide-semiconductor field-effect transistor (MOSFET) having theirsource terminals coupled to a first node, their gate terminals coupledto receive a first and second differential logic signals, respectively,and their drain terminals coupled respectively to first and secondoutput nodes; first and second series RL circuits respectively coupledbetween the first and second output nodes and a logic high level; firstand second capacitive loads (C_(L)) respectively coupled to the outputnodes; and a current-source n-channel MOSFET coupled between the sourceterminals to the first and second n-channel MOSFETs and a logic lowlevel.
 3. The circuitry of claim 2, wherein: each RL circuit of thefirst and second series RL circuits includes a resistor and an inductorconnected in series; and the inductor of each RL circuit of the firstand second series RL circuits is a spiral inductor coupled to thesilicon substrate.
 4. The circuitry of claim 2, wherein; each RL circuitof the first and second series RL circuits includes a resistor and aninductor connected in series; and the resistor of each RL circuit of thefirst and second series RL circuits is a p-channel MOSFET that operatessubstantially in its linear operating region.
 5. The circuitry of claim2, wherein: each RL circuit of the first and second series RL circuitsincludes a resistor and an inductor connected in series; and theresistor of each RL circuit of the first and second series RL circuitsis a polysilicon resistor fabricated of polysilicon materials.
 6. Thecircuitry of claim 1, wherein: the core circuitry performs monitoringand error correction of each signal of the first plurality of signalshaving the second frequency.
 7. The circuitry of claim 6, wherein: thecore circuitry is implemented as an application specification integratedcircuit (ASIC).
 8. The circuitry of claim 1, further comprising: a laserdriver circuitry, communicatively coupled to the serializer, thatreceives the output signal having the first frequency, that converts theoutput signal from an electrical signal format to a fiber-optic signalhaving an optical signal format compatible with a fiber-opticcommunication channel, and transmits the fiber-optic signal onto thefiber-optic communication channel.
 9. The circuitry of claim 1, furthercomprising: a photo detect and driver circuitry, communicatively coupledto a fiber optic communication channel, that receives a fiber-opticsignal there from and that converts the fiber-optic signal to a channelsignal having an electrical signal format that is arranged into aplurality of data packets; and a clock data recovery (CDR) circuitry,communicatively coupled to the photo detect and driver circuitry, thatreceives the channel signal and that recovers a clock and a data signalthere from.
 10. A circuitry fabricated on a silicon substrate, thecircuitry comprising: a deserializer, implemented usingcurrent-controlled complementary metal-oxide semiconductor (C³MOS) logicwith inductive broadbanding, that receives an input signal having afrequency and generates a plurality of signals there from such that eachsignal of the plurality of signals has a second frequency that is lowerthan the first frequency; wherein the deserializer is implemented usingfirst and second n-channel metal-oxide-semiconductor field-effecttransistor (MOSFET) having their source terminals coupled to a firstnode, their gate terminals coupled to receive a first and seconddifferential logic signals, respectively, and their drain terminalscoupled respectively to first and second output nodes; first and secondseries RL circuits respectively coupled between the first and secondoutput nodes and a logic high level; first and second capacitive loads(C_(L)) respectively coupled to the output nodes; and a current-sourcen-channel MOSFET coupled between the source terminals to the first andsecond n-channel MOSFETs and a logic low level.
 11. The circuitry ofclaim 10, further comprising: core circuitry, implemented usingconventional complementary metal-oxide-semiconductor (CMOS) logic, thatis communicatively coupled to the deserializer and that processes eachsignal of the plurality of signals having the second frequency therebygenerating a processed plurality of signals such that each signal of theprocessed plurality of signals also has the second frequency; and aserializer, implemented using C³MOS logic with inductive broadbanding,that is communicatively coupled to the core circuitry and that receiveseach signal of the processed plurality of signals and that generates anoutput signal there from that has the first frequency.
 12. The circuitryof claim 11, further comprising: a laser driver circuitry,communicatively coupled to the serializer, that receives the outputsignal having the first frequency, that converts the output signal froman electrical signal format to a fiber-optic signal having an opticalsignal format compatible with a fiber-optic communication channel, andtransmits the fiber-optic signal onto the fiber-optic communicationchannel.
 13. The circuitry of claim 11, further comprising: a photodetect and driver circuitry, communicatively coupled to a fiber opticcommunication channel, that receives a fiber-optic signal there from andthat converts the fiber-optic signal to a channel signal having anelectrical signal format that is arranged into a plurality of datapackets; and a clock data recovery (CDR) circuitry, communicativelycoupled to the photo detect and driver circuitry, that receives theplurality of data packets of the channel signal and that recovers aclock and a data signal there from.
 14. The circuitry of claim 10,wherein: each RL circuit of the first and second series RL circuitsincludes a resistor and an inductor connected in series; and theinductor of each RL circuit of the first and second series RL circuitsis a spiral inductor coupled to the silicon substrate.
 15. The circuitryof claim 10, wherein: each RL circuit of the first and second series RLcircuits includes a resistor and an inductor connected in series; andthe resistor of each RL circuit of the first and second series RLcircuits is a p-channel MOSFET that operates substantially in its linearoperating region.
 16. The circuitry of claim 10, wherein: each RLcircuit of the first and second series RL circuits includes a resistorand an inductor connected in series; and the resistor of each RL circuitof the first and second series RL circuits is a polysilicon resistorfabricated of polysilicon materials.
 17. The circuitry of claim 10,wherein: the core circuitry performs monitoring and error correction ofeach signal of the first plurality of signals having the secondfrequency.
 18. The circuitry of claim 17, wherein: the core circuitry isimplemented as an application specification integrated circuit (ASIC).19. A transceiver, comprising: a photo detect and driver circuitry,communicatively coupled to a fiber optic communication channel, thatreceives an input fiber-optic signal there from and that converts theinput fiber-optic signal to a channel signal having an electrical signalformat that is arranged into a plurality of data packets; a clock datarecovery (CDR) circuitry, communicatively coupled to the photo detectand driver circuitry, that receives the plurality of data packets of thechannel signal and that recovers a clock and an input data signal therefrom; a deserializer, implemented using current-controlled complementarymetal-oxide semiconductor (C³MOS) logic with inductive broadbanding,that receives the input data signal having a first frequency andgenerates a first plurality of signals there from such that each signalof the first plurality of signals has a second frequency that is lowerthan the first frequency; core circuitry, implemented using conventionalcomplementary metal-oxide-semiconductor (CMOS) logic, that iscommunicatively coupled to the deserializer and that processes eachsignal of the first plurality of signals having the second frequencythereby generating a second plurality of signals such that each signalof the second plurality of signals also has the second frequency; aserializer, implemented using C³MOS logic with inductive broadbanding,that is communicatively coupled to the core circuitry and that receiveseach signal of the second plurality of signals and that generates anoutput data signal there from that has the first frequency; and a laserdriver circuitry, communicatively coupled to the serializer, thatreceives the output data signal having the first frequency, thatconverts the output data signal from an electrical signal format to anoutput fiber-optic signal having an optical signal format compatiblewith the fiber-optic communication channel, and transmits the outputfiber-optic signal onto the fiber-optic communication channel.
 20. Thecircuitry of claim 19, wherein: at least one of the serializer and thedeserializer is implemented using first and second n-channelmetal-oxide-semiconductor field-effect transistor (MOSFET) having theirsource terminals coupled to a first node, their gate terminals coupledto receive a first and second differential logic signals, respectively,and their drain terminals coupled respectively to first and secondoutput nodes; first and second series RL circuits respectively coupledbetween the first and second output nodes and a logic high level; firstand second capacitive loads (C_(L)) respectively coupled to the outputnodes; and a current-source n-channel MOSFET coupled between the sourceterminals to the first and second n-channel MOSFETs and a logic lowlevel.